Laser dicing/ drilling in silicon, glass, sapphire, ceramics, metal and other material, is widely used in semiconductors, MEMS, LED, RFID, NFC, and so on.
Deli has launched several production job for these application, as well as many prototyping jobs.
LED sapphire wafer dicing
 
sapphire substrate scribing
Silicon wafer drilling
Glass-silicon bonding wafer cutting，0.5mm thick glass+ 0.24mm silicon
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The job shop
Mass production management |
江阴德力激光有限公司
