Focus on MicroLaser fine cutting, glass cutting,micro drilling,wafer scribing,pattern etching

Focus on MicroLaser fine cutting, glass cutting,micro drilling,wafer scribing,pattern etching

Focus on Micro

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Laser glass cutting

We have developped five different precosses for glass cutting and micro drilling, depends on the customers' different requirements of prcision,chipping, cost and design, especially straight cutting or grometric cutting. We have successfully launched our technology to consumer electronics, display, medical, semiconductors, solar cell, optics, etc

Now we could cut thin glass(less than 1mm thick) fast and no chpping, both tempered and non-tempered; we could drilling 0.1mm holes in 5mm thick glass and make many kinds of 2.5D structures inside the glass.

Please free free to contact with us if you have micro job in Glass

About Us

Deli Laser Solutions offers all kinds of precision micro Laser cutting, Laser drilling, etching, Laser Micromachining,scribing, dicing, ablation, fabrication, engraving and marking with feature sizes of microns ,main applications including LED chips manufacturing, touch panel, LCD, consumer electronics, semiconductors, MEMS, lighting and medical industries, as well as R&D, aerospace and military use. …

Service

Deli Laser Solutions provides all kinds of flexible services for different customers, no matter you are big, medium-sized and small enterprises, or research centers and universities. You may find different solutions from sampling to production.

Find more micromachining cases >>

Fine cutting
Fine cutting of all kinds of thin material with UV laser, fiber laser and ultra-fast lasers

Micro drilling
5micron precision, 20:1 ratio, Max 1mm thickness, Min hole size 5micron, all kind of materials

Wafer dicing
Laser scribing/dicing/grooving in silicon,glass,sapphire, ceramics, metal wafers

Pattern etching
Laser patterning of ITO, Ag, ink and many other coatings according to customized design

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江阴德力激光有限公司